TY  - CONF
A1  - Fibich, Christian
A1  - Horauer, Martin
A1  - Obermaisser, Roman
T1  - Characterization of Interconnect Fault Effects in SRAM-based FPGAs
T2  - Proceedings of the 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2023), 3-5 May 2023, Tallinn, Estonia
KW  - Soft Errors
KW  - FPGA
KW  - Interconnect Fault
Y1  - 
UR  - http://opus.technikum-wien.at/frontdoor/index/index/docId/3419
SP  - 65
EP  - 68
ER  -