TY  - CHAP
A1  - Fibich, Christian
A1  - Horauer, Martin
A1  - Obermaisser, Roman
T1  - Characterization of Interconnect Fault Effects in SRAM-based FPGAs
T2  - Proceedings of the 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2023), 3-5 May 2023, Tallinn, Estonia
KW  - Soft Errors
KW  - FPGA
KW  - Interconnect Fault
Y1  - 
U6  - http://dx.doi.org/https://doi.org/10.1109/DDECS57882.2023.10139343
SP  - 65
EP  - 68
ER  - 
TY  - CHAP
A1  - Fibich, Christian
A1  - Horauer, Martin
A1  - Obermaisser, Roman
T1  - Bitstream-Level Interconnect Fault Characterization for SRAM-based FPGAs
T2  - Proceedings of the 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE 2023), pp. 1-2, 16-18 April 2023, Antwerp, Belgium
KW  - FPGA
KW  - Fault Injection
KW  - Interconnect Fault
Y1  - 
U6  - http://dx.doi.org/10.23919/DATE56975.2023.10136911
ER  -