TY - GEN A1 - Fibich, Christian A1 - Tauner, Stefan A1 - Rössler, Peter A1 - Horauer, Martin A1 - Matschnig, Martin A1 - Taucher, Herbert T1 - Preliminary Evaluation of High-level Synthesis Tools - Xilinx Vivado and PandA Bambu KW - FPGA KW - HLS KW - High-Level Synthesis Y1 - ER - TY - CHAP A1 - Fibich, Christian A1 - Horauer, Martin A1 - Obermaisser, Roman T1 - Device- and Temperature Dependency of Systematic Fault Injection Results in Artix-7 and iCE40 FPGAs T2 - Proceedings of the 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-5 February 2021, Grenoble, France KW - FPGA KW - Fault Injection KW - Device Variations Y1 - SP - 1600 EP - 1605 ER - TY - CHAP A1 - Fibich, Christian A1 - Tauner, Stefan A1 - Rössler, Peter A1 - Horauer, Martin A1 - Matschnig, Martin A1 - Taucher, Herbert T1 - Preliminary Evaluation of High-level Synthesis Tools - Xilinx Vivado and PandA Bambu T2 - IEEE 13th International Symposium on Industrial Embedded Systems (SIES), Graz, 2018 KW - FPGA KW - HLS KW - High-Level Synthesis Y1 - 2018 ER - TY - JOUR A1 - Fibich, Christian A1 - Tauner, Stefan A1 - Rössler, Peter A1 - Horauer, Martin A1 - Matschnig, Martin A1 - Taucher, Herbert T1 - FIJI – Fault InJection Instrumenter JF - EURASIP Journal on Embedded Systems KW - Fault injection KW - FPGA KW - Safety-critical system KW - Verification KW - Electronic design automation Y1 - 2019 VL - 2019 IS - Februar 2019 ER - TY - CHAP A1 - Fibich, Christian A1 - Horauer, Martin A1 - Obermaisser, Roman T1 - Vulnerability Analysis of Storage Elements in HLS-Generated Designs using High-Level Profiling T2 - Proceedings of the 2nd International Conference on System Reliability and Safety (ICSRS2017), 20-22 December 2017, Milan, Italy KW - High-Level Synthesis KW - Functional Safety KW - FPGA Y1 - 2017 SP - 190 EP - 194 ER - TY - CHAP A1 - Fibich, Christian A1 - Horauer, Martin A1 - Obermaisser, Roman T1 - Characterization of Interconnect Fault Effects in SRAM-based FPGAs T2 - Proceedings of the 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2023), 3-5 May 2023, Tallinn, Estonia KW - Soft Errors KW - FPGA KW - Interconnect Fault Y1 - U6 - http://dx.doi.org/https://doi.org/10.1109/DDECS57882.2023.10139343 SP - 65 EP - 68 ER - TY - CHAP A1 - Fibich, Christian A1 - Horauer, Martin A1 - Obermaisser, Roman T1 - Bitstream-Level Interconnect Fault Characterization for SRAM-based FPGAs T2 - Proceedings of the 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE 2023), pp. 1-2, 16-18 April 2023, Antwerp, Belgium KW - FPGA KW - Fault Injection KW - Interconnect Fault Y1 - U6 - http://dx.doi.org/10.23919/DATE56975.2023.10136911 ER -