TY  - CHAP
A1  - Glatz, Bernd
A1  - Schuster, Harald
A1  - Horauer, Martin
A1  - Rauscher, Thomas
A1  - Obermaisser, Roman
T1  - Fault Injection for IEC 61499 Applications
T2  - Proceedings of the 21st IEEE International Conference on Emerging Technologies and Factory Automation (ETFA 2016), Berlin, Germany, 2016-09-06 -- 2016-09-09
KW  - Embedded Systems
Y1  - 2018
ER  - 
TY  - GEN
A1  - Glatz, Bernd
A1  - Schuster, Harald
A1  - Horauer, Martin
A1  - Rauscher, Thomas
A1  - Obermaisser, Roman
T1  - Fault Injection for IEC 61499 Applications
KW  - Embedded Systems
Y1  - 2018
ER  - 
TY  - CHAP
A1  - Fibich, Christian
A1  - Horauer, Martin
A1  - Obermaisser, Roman
T1  - HLShield: A Reliability Enhancement Framework for High-Level Synthesis
T2  - 12th IEEE International Symposium on Industrial Embedded Systems (SIES 2017)
KW  - Embedded Systems
Y1  - 2018
ER  - 
TY  - CHAP
A1  - Fibich, Christian
A1  - Horauer, Martin
A1  - Obermaisser, Roman
T1  - Device- and Temperature Dependency of Systematic Fault Injection Results in Artix-7 and iCE40 FPGAs
T2  - Proceedings of the 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-5 February 2021, Grenoble, France
KW  - FPGA
KW  - Fault Injection
KW  - Device Variations
Y1  - 
SP  - 1600
EP  - 1605
ER  - 
TY  - CHAP
A1  - Fibich, Christian
A1  - Horauer, Martin
A1  - Obermaisser, Roman
T1  - Reliability-Enhanced High-Level Synthesis using Memory Profiling and Fault Injection
T2  - 2019 IEEE 28th International Symposium on Industrial Electronics (ISIE), Vancouver, BC, Canada, 2019
KW  - Circuit faults
KW  - Reliability engineering
KW  - Field programmable gate arrays
KW  - Fault tolerance
KW  - Fault tolerant systems
Y1  - 2019
SP  - 1363
EP  - 1370
ER  - 
TY  - CHAP
A1  - Fibich, Christian
A1  - Horauer, Martin
A1  - Obermaisser, Roman
T1  - Vulnerability Analysis of Storage Elements in HLS-Generated Designs using High-Level Profiling
T2  - Proceedings of the 2nd International Conference on System Reliability and Safety (ICSRS2017), 20-22 December 2017, Milan, Italy
KW  - High-Level Synthesis
KW  - Functional Safety
KW  - FPGA
Y1  - 2017
SP  - 190
EP  - 194
ER  - 
TY  - CHAP
A1  - Fibich, Christian
A1  - Horauer, Martin
A1  - Obermaisser, Roman
T1  - Characterization of Interconnect Fault Effects in SRAM-based FPGAs
T2  - Proceedings of the 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2023), 3-5 May 2023, Tallinn, Estonia
KW  - Soft Errors
KW  - FPGA
KW  - Interconnect Fault
Y1  - 
U6  - http://dx.doi.org/https://doi.org/10.1109/DDECS57882.2023.10139343
SP  - 65
EP  - 68
ER  - 
TY  - CHAP
A1  - Fibich, Christian
A1  - Horauer, Martin
A1  - Obermaisser, Roman
T1  - Bitstream-Level Interconnect Fault Characterization for SRAM-based FPGAs
T2  - Proceedings of the 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE 2023), pp. 1-2, 16-18 April 2023, Antwerp, Belgium
KW  - FPGA
KW  - Fault Injection
KW  - Interconnect Fault
Y1  - 
U6  - http://dx.doi.org/10.23919/DATE56975.2023.10136911
ER  -