Characterization of Interconnect Fault Effects in SRAM-based FPGAs
| Author: | Christian Fibich, Martin Horauer, Roman Obermaisser |
|---|---|
| DOI: | https://doi.org/https://doi.org/10.1109/DDECS57882.2023.10139343 |
| Parent Title (English): | Proceedings of the 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2023), 3-5 May 2023, Tallinn, Estonia |
| Document Type: | Conference Proceeding |
| Language: | English |
| Completed Date: | 2023/05/05 |
| Responsibility for metadata: | Fachhochschule Technikum Wien |
| Release Date: | 2023/10/17 |
| GND Keyword: | FPGA; Interconnect Fault; Soft Errors |
| First Page: | 65 |
| Last Page: | 68 |
| Publish on Website: | 1 |
| Open Access: | 0 |
| Reviewed: | 1 |
| Invited: | 0 |
| Keynote: | 0 |
| Department: | Department Electronic Engineering |
| Dewey Decimal Classification: | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften |
| Research Focus: | Embedded Systems & Cyber-Physical Systems |
| Projects: | CDG |
| Studienjahr: | 2021/2022 |
