Characterization of Interconnect Fault Effects in SRAM-based FPGAs
Author: | Christian Fibich, Martin Horauer, Roman Obermaisser |
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DOI: | https://doi.org/https://doi.org/10.1109/DDECS57882.2023.10139343 |
Parent Title (English): | Proceedings of the 26th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2023), 3-5 May 2023, Tallinn, Estonia |
Document Type: | Conference Proceeding |
Language: | English |
Completed Date: | 2023/05/05 |
Responsibility for metadata: | Fachhochschule Technikum Wien |
Release Date: | 2023/10/17 |
GND Keyword: | FPGA; Interconnect Fault; Soft Errors |
First Page: | 65 |
Last Page: | 68 |
Publish on Website: | 1 |
Open Access: | 0 |
Reviewed: | 1 |
Invited: | 0 |
Keynote: | 0 |
Department: | Department Electronic Engineering |
Dewey Decimal Classification: | 6 Technik, Medizin, angewandte Wissenschaften / 62 Ingenieurwissenschaften |
Research Focus: | Embedded Systems & Cyber-Physical Systems |
Projects: | CDG |
Studienjahr: | 2021/2022 |