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Bitstream-Level Interconnect Fault Characterization for SRAM-based FPGAs
Author: | Christian Fibich, Martin Horauer, Roman Obermaisser |
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DOI: | https://doi.org/10.23919/DATE56975.2023.10136911 |
Parent Title (English): | Proceedings of the 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE 2023), pp. 1-2, 16-18 April 2023, Antwerp, Belgium |
Document Type: | Conference Proceeding |
Language: | English |
Completed Date: | 2023/04/18 |
Responsibility for metadata: | Fachhochschule Technikum Wien |
Release Date: | 2023/11/09 |
GND Keyword: | FPGA; Fault Injection; Interconnect Fault |
Pagenumber: | 2 |
Publish on Website: | 1 |
Open Access: | 0 |
Reviewed: | 1 |
Invited: | 0 |
Keynote: | 0 |
Department: | Department Electronic Engineering |
Dewey Decimal Classification: | 6 Technik, Medizin, angewandte Wissenschaften / 60 Technik |
Research Focus: | Embedded Systems & Cyber-Physical Systems |
Projects: | CDG |
Studienjahr: | 2022/2023 |