Bitstream-Level Interconnect Fault Characterization for SRAM-based FPGAs
| Author: | Christian Fibich, Martin Horauer, Roman Obermaisser |
|---|---|
| DOI: | https://doi.org/10.23919/DATE56975.2023.10136911 |
| Parent Title (English): | Proceedings of the 2023 Design, Automation & Test in Europe Conference & Exhibition (DATE 2023), pp. 1-2, 16-18 April 2023, Antwerp, Belgium |
| Document Type: | Conference Proceeding |
| Language: | English |
| Completed Date: | 2023/04/18 |
| Responsibility for metadata: | Fachhochschule Technikum Wien |
| Release Date: | 2023/11/09 |
| GND Keyword: | FPGA; Fault Injection; Interconnect Fault |
| Pagenumber: | 2 |
| Publish on Website: | 1 |
| Open Access: | 0 |
| Reviewed: | 1 |
| Invited: | 0 |
| Keynote: | 0 |
| Department: | Department Electronic Engineering |
| Dewey Decimal Classification: | 6 Technik, Medizin, angewandte Wissenschaften / 60 Technik |
| Research Focus: | Embedded Systems & Cyber-Physical Systems |
| Projects: | CDG |
| Studienjahr: | 2022/2023 |
